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HDI PCB

High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006” (150um) or less in diameter. 

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By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

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Capabilities

Feature Capability
Number of Layers 4-30 layers
Quality Grade IPC 6016 Class 2, IPC 6016 Class 3
Material Tg 150°C FR4, Tg 170°C FR4, Tg >170°C FR4, Special material
Thickness 0.4 - 6.0 mm
Min Track / Spacing 2-8 mil
Min Hole Size 0.15 mm - 0.3 mm
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte Green
Silkscreen White, Black, Yellow, Blue
Surface Finish Immersion gold, OSP, Hard Gold, Immersion Silver
Finished Copper 0.5-13oz
Manufacturing time 5-10 days
Transport time 1-3 days

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