Get a quote


High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006” (150um) or less in diameter. 

Learn more

By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

Explore our other products

Learn more how we ensure quality of our products.

Learn more


Feature Capability
Number of Layers 4-30 layers
Quality Grade IPC 6016 Class 2, IPC 6016 Class 3
Material Tg 150°C FR4, Tg 170°C FR4, Tg >170°C FR4, Special material
Thickness 0.4 - 6.0 mm
Min Track / Spacing 2-8 mil
Min Hole Size 0.15 mm - 0.3 mm
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte Green
Silkscreen White, Black, Yellow, Blue
Surface Finish Immersion gold, OSP, Hard Gold, Immersion Silver
Finished Copper 0.5-13oz
Manufacturing time 5-10 days
Transport time 1-3 days

Contact sales

Let’s get this conversation started. Tell us a bit about yourself, and your needs. We will get back to you within few hours.

Get a quotation

    We will get back to you within few hours