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High Frequency PCB

Electronic devices with high frequency are the developing tendency nowadays, especially in wireless networks. Satellite communication growing rapidly, information products move towards high speed and high frequency. 

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Thus developing new high frequency products often need to use high frequency substrate, for example satellite systems, mobile telephone base stations etc, these communication products usually use high frequency substrates when designing the PCB.

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Capabilities

Feature Capability
Material Rogers, Arlon, Taconic, Neltec, etc.
Min. Track / Spacing 2 mil
Min. Hole Size 0.15 mm
Finished Cooper 1-2 oz
Board Thickness 0.2 - 3.2 mm
Surface Finishing Immersion Gold, OSP, Hard Gold, Immersion Silver, Enepig
Finsih Cooper 0.5-13oz
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte Green
Silkscreen White, Black
Via Process Tenting Vias, Plugged Vias, Vias not covered
Testing Fly Probe Testing (Free) and A.O.I. testing
Manufacturing time 7-10 days
Transport time 1-3 days

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