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Rigid-Flex PCB

What is a RIGID-FLEX PCB?

RIGID-FLEX printed circuit boards combine the benefits of flexible and stiff board technologies. Depending on the application, most rigid-flex boards have some layers of flexible circuit substrates linked to one or more rigid boards externally and/or internally. Flexible substrates are made in a constant state of flex and can be frequently bent into a flexed curve during the complete lifecycle of the product.

Where are RIGID-FLEX PCBs used?

RIGID-FLEX PCBs offer various applications, ranging from smart devices to cell phones and digital cameras. RIGID-FLEX board fabrication has been increasingly used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for RIGID-FLEX PCB usage can be applied to aviation and the military.

In consumer products, RIGID-FLEX does not just maximize space and weight but significantly improves reliability and improved signal integrity eliminating many needs for solder joints and delicate, fragile wiring prone to connection issues. These are just some examples, but RIGID-FLEX PCBs can be used to benefit nearly all advanced electrical applications, including testing equipment, tools, and automobiles.

How are RIGID-FLEX PCBs made?

RIGID-FLEX board designs are more challenging to create than traditional rigid board designs because they are made in 3D space, which allows for higher spatial efficiency. Designers can twist, fold, and roll flexible board substrates to get their desired results by designing three dimensions.

In the early phases of designing, it is beneficial to carefully consider and thoroughly evaluate the available possibilities of RIGID-FLEX solutions that will yield considerable benefits. In addition, it’s vital to involve the PCB fabricator early in the design process to guarantee that the design and fabrication phases are in sync and that final product changes are considered.

The method has been proven and reliable in various applications, including stiff flex prototypes and large-scale PCB fabrication and PCB assembly. The flex PCB section excels in overcoming space and weight constraints with spatial degrees of freedom.

Capabilities

Feature

Capability

Number of Layers

1-8 layers

Build Time

3-5 days

Polyimide base material

Polyimide, PET, Polyester-Flex

FPC Thickness

0.08 mm - 0.4 mm

Min Track / Spacing

>=0.06 mm

Min Hole Size (diameter)

>=0.35 mm

Coverlay (Flex Part)

Yellow Coverlay, White Coverlay, Black Coverlay

Silkscreen Color

White,Black

Surface Finish

Immersion Gold, OSP, Immersion Silver, Immersioni Tin

Finished Copper

0.5 oz - 2 oz

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Capabilities

Feature Capability
Number of Layers 1-8 layers
Build Time 3-5 days
Polyimide base material Polyimide, PET, Polyester-Flex
FPC Thickness 0.08 mm - 0.4 mm
Min Track / Spacing >=0.06 mm
Min Hole Size (diameter) >=0.35 mm
Coverlay (Flex Part) Yellow Coverlay, White Coverlay, Black Coverlay
Silkscreen Color White,Black
Surface Finish Immersion Gold, OSP, Immersion Silver, Immersioni Tin
Finished Copper 0.5 oz - 2 oz

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